The minimum Cu-thickness is fulfilled.No sign of cracks around the nodule-area.The hole wall exhibits an otherwise smooth an coherent structure.Nodules Acceptable on the condition that: No circumferential void in excess of 90° (circumferential crack).No voids at the pad-to-barrel interface.The total area of voids per hole must not exceed 5% of the area of the hole.No more than 3 voids per hole in no more than 2% of the solder holes. ![]() Effects that we may spot but as Eurocircuits want to avoid in production are: Voids From every production batch we select some coupons and make micro sections of the PTH to check the quality of the PTH in the final PCB. On every production panel we include test coupons. To check the quality of PTH after the galvanic process we measure on every production panel the Cu plating thickness of several holes.
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